Study of Mechanical and Tribological Behaviour of Cu-SiCp Metal Matrix Composites

Rabinarayan Sethi, Rajesh Kumar Ojha, Madhumita Sahoo

Abstract: Copper Silicon carbide (Cu-SiCp) composites find its application as heat resistant and wear materials in electrical sliding contacts such as in electric switch, low dielectric constant dielectric layers in integrated circuits and wiring board where high electrical/thermal conductivity combined with good wear properties is required. In the present investigation SiC particle has been used for developing Cu-based MMCs. The main aim is to improve wear resistance and mechanical properties of Cu-SiCp metal matrix composite with minor loss of electrical conductivity. Cu-SiCp metal matrix composites containing 5, 10 and 15 wt. % of silicon carbide have been prepared by Stir casting process. Wear, Hardness, Tensile strength experiments were carried out to examine the surface mechanical properties as well as the wear properties of the prepared composite. It has been observed that the reinforcement is distributed homogeneously all over the Cu-matrix and also composites have good bonding between the Cu-matrix and the reinforcement. Cu with SiC reinforced composite having 15% wt. fraction is found to exhibit best result.

Keywords: MMCs, stir casting process, electrical conductivity, wear resistance